&<α↓nbsp; With the λ♦∏development of science and technolδ‌∏ogy and electronic technology, es&¥&pecially under the con×☆↓cept of Industry 4.0, the ×↔intelligentization of equipment and <∏•εthe Internet of Everyπ¶↕thing have used a large number"β€✔ of electronic products on ₩∞☆the equipment. The reliability req♦σ׶uirements of these pro$☆ducts are very high, and the heat diss•↓ipation requirements and EMI requ∑≤≠§irements are also very urgent.

      ÷™±  National defense and mε♦↔ilitary products, but★  also the demand for h£€♠igh-precision parts. The reqΩε→✔uirements for thermal conductivity an↓&d EMI are even more demanding. Such☆₩​Ω as phased array radar, mα<±issiles, military command vehi$​cles, stealth fighters, stealth drone​₽∑​s, etc., a variety of hi≥αgh-specification thermal interface mat✘φ​∞erials, conductive shielding matδ δ§erials and electromagnetic absorbi₹Ω'ng materials are required.