EMI/RFI Absorbing/Thermal Conductin ♠↕g Materials
Achieve low interfacial thermεal resistance performance and electrom×<¶agnetic absorption performance, which c δΩan fill the gap and complet™₩★e the heat transfer and electromagnet ₩ic noise absorption betwe§§en the heating and heat dissi£✘ βpation parts; At the₩φ same time, it also p★↔≈₹lays the role of insulation, shock ab"&sorption, sealing and σ>so on, to meet the design requiremen↕πts of equipment miniaturizatiλ₩on and ultra-thinning
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