• Uniform fine closed holes.
• Low density, meeting lightweight¶¥ requirements.
• Excellent compressive deformation abili∏±₽ty.
• Excellent flame retardancy to meε∞et the requirements of £δ≈UL94 V-0.
• Low thermal conductivity, ex∑¶cellent heat insulation.
• Wide compression ratio t¶✔o absorb cell expansion force.
• -55℃~200℃ for high and σ☆φ low temperature environment.